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HAF70009
Data Sheet August 1999 File Number
4770
56A, 100V, 0.025 Ohm, N-Channel UltraFET Power MOSFET
This N-Channel power MOSFET is manufactured using the innovative UltraFETTM process. This advanced process technology achieves the lowest possible on-resistance per silicon area, resulting in outstanding performance. This device is capable of withstanding high energy in the avalanche mode and the diode exhibits very low reverse recovery time and stored charge. It was designed for use in applications where power efficiency is important, such as switching regulators, switching converters, motor drivers, relay drivers, lowvoltage bus switches, and power management in portable and battery-operated products. Formerly developmental type TA75639.
Features
* 56A, 100V * Simulation Models - Temperature Compensated PSPICE(R) and SABER(c) Electrical Models - Spice and Saber Thermal Impedance Models - www.intersil.com * Peak Current vs Pulse Width Curve * UIS Rating Curve * Related Literature - TB334, "Guidelines for Soldering Surface Mount Components to PC Boards"
Symbol
D
Ordering Information
PART NUMBER HAF70009 PACKAGE TO-220AB TEMP. RANGE (oC) -55 to 175
G
S
Packaging
JEDEC TO-220AB
SOURCE DRAIN GATE DRAIN (FLANGE)
Absolute Maximum Ratings
TC = 25oC, Unless Otherwise Specified HAF70009 100 100 20 56 Figure 4 Figures 6, 14, 15 200 1.35 -55 to 175 300 260 UNITS V V V A
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS Drain to Gate Voltage (RGS = 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS Drain Current Continuous (Figure 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL Package Body for 10s, See Tech Brief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg
W W/oC oC
oC oC
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 1. TJ = 25oC to 150oC.
4-1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright (c) Intersil Corporation 1999. SABER(c) is a Copyright of Analogy, Inc. UltraFETTM is a trademark of Intersil Corporation. PSPICE(R) is a registered trademark of MicroSim Corporation.
HAF70009
Electrical Specifications
PARAMETER OFF STATE SPECIFICATIONS Drain to Source Breakdown Voltage Zero Gate Voltage Drain Current BVDSS IDSS ID = 250A, VGS = 0V (Figure 11) VDS = 90V, VGS = 0V VDS = 80V, VGS = 0V, TC = 150oC Gate to Source Leakage Current ON STATE SPECIFICATIONS Gate to Source Threshold Voltage Drain to Source On Resistance THERMAL SPECIFICATIONS Thermal Resistance Junction to Case Thermal Resistance Junction to Ambient SWITCHING SPECIFICATIONS (VGS = 10V) Turn-On Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-Off Time GATE CHARGE SPECIFICATIONS Total Gate Charge Gate Charge at 10V Threshold Gate Charge Gate to Source Gate Charge Reverse Transfer Capacitance CAPACITANCE SPECIFICATIONS Input Capacitance Output Capacitance Reverse Transfer Capacitance CISS COSS CRSS VDS = 25V, VGS = 0V, f = 1MHz (Figure 12) 2000 500 65 pF pF pF Qg(TOT) Qg(10) Qg(TH) Qgs Qgd VGS = 0V to 20V VGS = 0V to 10V VGS = 0V to 2V VDD = 50V, ID 56A, RL = 0.89 Ig(REF) = 1.0mA (Figures 13, 16, 17) 110 57 3.7 9.8 24 130 75 4.5 nC nC nC nC nC tON td(ON) tr td(OFF) tf tOFF VDD = 50V, ID 56A, RL = 0.89, VGS = 10V, RGS = 5.1 (Figures 18,19) 15 60 20 25 110 70 ns ns ns ns ns ns RJC RJA (Figure 3) TO-220 0.74 62
oC/W oC/W
TC = 25oC, Unless Otherwise Specified SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
100 -
-
1 250 100
V A A nA
IGSS
VGS = 20V
VGS(TH) rDS(ON)
VGS = VDS, ID = 250A (Figure 10) ID = 56A, VGS = 10V (Figure 9)
2 -
0.021
4 0.025
V
Source to Drain Diode Specifications
PARAMETER Source to Drain Diode Voltage Reverse Recovery Time Reverse Recovered Charge SYMBOL VSD trr QRR ISD = 56A ISD = 56A, dISD/dt = 100A/s ISD = 56A, dISD/dt = 100A/s TEST CONDITIONS MIN TYP MAX 1.25 110 320 UNITS V ns nC
4-2
HAF70009 Typical Performance Curves
1.2 POWER DISSIPATION MULTIPLIER 1.0 0.8 0.6 0.4 0.2 0 0 25 50 75 100 125 150 175 TC , CASE TEMPERATURE (oC) 60 50 40 30 20 10 0 25 50 75 100 125 150 175 TC, CASE TEMPERATURE (oC)
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE TEMPERATURE
2 1 ZJC, NORMALIZED THERMAL IMPEDANCE DUTY CYCLE - DESCENDING ORDER 0.5 0.2 0.1 0.05 0.02 0.01 PDM t1 t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJC x RJC + TC 10-3 10-2 t, RECTANGULAR PULSE DURATION (s) 10-1 100 101
0.1
SINGLE PULSE 0.01 10-5 10-4
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
1000
ID, DRAIN CURRENT (A)
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs CASE TEMPERATURE
TC = 25oC
IDM, PEAK CURRENT (A)
FOR TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT AS FOLLOWS: I = I25 175 - TC 150
100
VGS = 10V
TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION 10 10-5 10-4 10-3 10-2 t, PULSE WIDTH (s) 10-1 100 101
FIGURE 4. PEAK CURRENT CAPABILITY
4-3
HAF70009 Typical Performance Curves
1000 TJ = MAX RATED TC = 25oC ID, DRAIN CURRENT (A)
(Continued)
300 IAS, AVALANCHE CURRENT (A)
If R = 0 tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD) If R 0 tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1]
100 STARTING TJ = 25oC STARTING TJ = 150oC
100 100s
10 OPERATION IN THIS AREA MAY BE LIMITED BY rDS(ON) 1 1 10 VDS, DRAIN TO SOURCE VOLTAGE (V)
1ms VDSS(MAX) = 100V 10ms
100
200
10 0.001
0.01 0.1 tAV, TIME IN AVALANCHE (ms)
1
NOTE: Refer to Intersil Application Notes AN9321 and AN9322. FIGURE 5. FORWARD BIAS SAFE OPERATING AREA FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING CAPABILITY
100 VGS = 6V ID, DRAIN CURRENT (A) ID, DRAIN CURRENT (A) 80 VGS ==20V VGS 20V VGS ==10V VGS 10V VGS 7V VGS ==7V
100 PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX VDD = 15V 175oC
80
60
60
40 VGS = 5V 20 PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX TC = 25oC 0 1 2 3 4 5 6 7 VDS, DRAIN TO SOURCE VOLTAGE (V)
40
20 25oC 0 0 1.5 3.0 4.5 6.0 7.5 VGS, GATE TO SOURCE VOLTAGE (V) -55oC
0
FIGURE 7. SATURATION CHARACTERISTICS
FIGURE 8. TRANSFER CHARACTERISTICS
3.0 NORMALIZED DRAIN TO SOURCE ON RESISTANCE 2.5 2.0 1.5 1.0 0.5 0
THRESHOLD VOLTAGE
PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX VGS = 10V, ID = 56A NORMALIZED GATE
1.2 VGS = VDS, ID = 250A
1.0
0.8
0.6 -80 -40 0 40 80 120 160 200 -80 -40 0 40 80 120 160 200 TJ, JUNCTION TEMPERATURE (oC) TJ, JUNCTION TEMPERATURE (oC)
FIGURE 9. NORMALIZED DRAIN TO SOURCE ON RESISTANCE vs JUNCTION TEMPERATURE
FIGURE 10. NORMALIZED GATE THRESHOLD VOLTAGE vs JUNCTION TEMPERATURE
4-4
HAF70009 Typical Performance Curves
1.2 NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE ID = 250A 2500 C, CAPACITANCE (pF) 1.1 2000 CISS 1500 1000 COSS 500 CRSS 0.9 -80 -40 0 40 80 120 160 200 TJ , JUNCTION TEMPERATURE (oC) 0 0 10 20 30 40 50 60 VDS , DRAIN TO SOURCE VOLTAGE (V)
(Continued)
3000 VGS = 0V, f = 1MHz CISS = CGS + CGD CRSS = CGD COSS CDS + CGD
1.0
FIGURE 11. NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE vs JUNCTION TEMPERATURE
10 VGS , GATE TO SOURCE VOLTAGE (V)
FIGURE 12. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
8
6
4 WAVEFORMS IN DESCENDING ORDER: ID = 56A ID = 37A ID = 18A 30 40 50 60
2 VDD = 50V 0 0 10 20
Qg, GATE CHARGE (nC)
NOTE: Refer to Intersil Application Notes AN7254 and AN7260. FIGURE 13. GATE CHARGE WAVEFORMS FOR CONSTANT GATE CURRENT
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HAF70009 Test Circuits and Waveforms
VDS BVDSS L VARY tP TO OBTAIN REQUIRED PEAK IAS VGS DUT tP RG IAS VDD tP VDS VDD
+
0V
IAS 0.01
0 tAV
FIGURE 14. UNCLAMPED ENERGY TEST CIRCUIT
FIGURE 15. UNCLAMPED ENERGY WAVEFORMS
VDS RL VDD VDS VGS = 20V VGS
+
Qg(TOT)
Qg(10) VDD VGS VGS = 2V 0 Qg(TH) Qgs Ig(REF) 0 Qgd VGS = 10V
DUT IG(REF)
FIGURE 16. GATE CHARGE TEST CIRCUIT
FIGURE 17. GATE CHARGE WAVEFORM
VDS
tON td(ON) RL VDS
+
tOFF td(OFF) tr tf 90%
90%
VGS
DUT RGS
VDD 0
10% 90%
10%
VGS VGS 0 10%
50% PULSE WIDTH
50%
FIGURE 18. SWITCHING TIME TEST CIRCUIT
FIGURE 19. RESISTIVE SWITCHING WAVEFORMS
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HAF70009 PSPICE Electrical Model
SUBCKT HUF75639 2 1 3 ;
CA 12 8 2.8e-9 CB 15 14 2.65e-9 CIN 6 8 1.9e-9 DBODY 7 5 DBODYMOD DBREAK 5 11 DBREAKMOD DPLCAP 10 5 DPLCAPMOD EBREAK 11 7 17 18 110 EDS 14 8 5 8 1 EGS 13 8 6 8 1 ESG 6 10 6 8 1 EVTHRES 6 21 19 8 1 EVTEMP 20 6 18 22 1 IT 8 17 1 LDRAIN 2 5 2e-9 LGATE 1 9 1e-9 LSOURCE 3 7 0.47e-9 RLGATE 1 9 10 RLDRAIN 2 5 20 RLSOURCE 3 7 4.69 MMED 16 6 8 8 MMEDMOD MSTRO 16 6 8 8 MSTROMOD MWEAK 16 21 8 8 MWEAKMOD
12 LGATE GATE 1 RLGATE CIN ESG + EVTEMP RGATE + 18 22 9 20 DPLCAP 10 RSLC1 51 ESLC 50 RLDRAIN DBREAK 11 + 17 EBREAK 18 5
rev Oct. 98
LDRAIN DRAIN 2
RSLC2
5 51
6 8 EVTHRES + 19 8 6
MSTRO LSOURCE 8 RSOURCE RLSOURCE 7 SOURCE 3
S1A 13 8 S1B CA 13 + EGS 6 8
S2A 14 13 S2B CB + EDS 5 8 14 IT 15 17
RBREAK 17 18 RBREAKMOD 1 RDRAIN 50 16 RDRAINMOD 1.3e-2 RGATE 9 20 0.7 RSLC1 5 51 RSLCMOD 1e-6 RSLC2 5 50 1e3 RSOURCE 8 7 RSOURCEMOD 4.5e-3 RVTHRES 22 8 RVTHRESMOD 1 RVTEMP 18 19 RVTEMPMOD 1 S1A S1B S2A S2B 6 12 13 8 S1AMOD 13 12 13 8 S1BMOD 6 15 14 13 S2AMOD 13 15 14 13 S2BMOD
-
-
VBAT 22 19 DC 1 ESLC 51 50 VALUE = {(V(5,51)/ABS(V(5,51)))*(PWR(V(5,51)/(1e-6*115),4))} .MODEL DBODYMOD D (IS = 1.4e-12 RS = 3.3e-3 XTI = 4.7 TRS1 = 2e-3 TRS2 = 0.1e-5 CJO = 3.3e-9 TT = 6.1e-8 M = 0.7) .MODEL DBREAKMOD D (RS = 3.5e-1 TRS1 = 1e-3 TRS2 = 1e-6) .MODEL DPLCAPMOD D (CJO = 2.2e-9 IS = 1e-30 N = 10 M = 0.95 vj = 1.0) .MODEL MMEDMOD NMOS (VTO = 3.5 KP = 4.8 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u Rg = 0.7) .MODEL MSTROMOD NMOS (VTO = 3.97 KP = 56.5 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u) .MODEL MWEAKMOD NMOS (VTO =3.11 KP = 0.085 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 7 RS = 0.1) .MODEL RBREAKMOD RES (TC1 = 0.8e-3 TC2 = 1e-6) .MODEL RDRAINMOD RES (TC1 = 1e-2 TC2 = 1.75e-5) .MODEL RSLCMOD RES (TC1 = 2.8e-3 TC2 = 14e-6) .MODEL RSOURCEMOD RES (TC1 = 0 TC2 = 0) .MODEL RVTHRESMOD RES (TC = -2.0e-3 TC2 = -1.75e-5) .MODEL RVTEMPMOD RES (TC1 = -2.75e-3 TC2 = 0.05e-9) .MODEL S1AMOD VSWITCH (RON = 1e-5 .MODEL S1BMOD VSWITCH (RON = 1e-5 .MODEL S2AMOD VSWITCH (RON = 1e-5 .MODEL S2AMOD VSWITCH (RON = 1e-5 .ENDS ROFF = 0.1 ROFF = 0.1 ROFF = 0.1 ROFF = 0.1 VON = -6.0 VOFF = -3.5) VON = -3.5 VOFF = -6.0) VON = -2.5 VOFF = 4.95) VON = 4.95 VOFF = -2.5)
NOTE: For further discussion of the PSPICE model, consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global Temperature Options; IEEE Power Electronics Specialist Conference Records, 1991, written by William J. Hepp and C. Frank Wheatley.
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+
-
RDRAIN 21 16
DBODY
MWEAK MMED
RBREAK 18 RVTEMP 19
VBAT +
8 22 RVTHRES
HAF70009 SABER Electrical Model
nom temp=25 deg c 100v Ultrafet
REV Oct. 98 template huf75639 n2,n1,n3 electrical n2,n1,n3 { var i iscl d..model dbodymod = (is=1.4e-12, xti=4.7, cjo=33e-10,tt=6.1e-8, m=0.7) d..model dbreakmod = () d..model dplcapmod = (cjo=22e-10,is=1e-30,n=10,m=0.95, vj=1.0) m..model mmedmod = (type=_n,vto=3.5,kp=4.8,is=1e-30, tox=1) m..model mstrongmod = (type=_n,vto=3.97,kp=56.5,is=1e-30, tox=1) m..model mweakmod = (type=_n,vto=3.11,kp=0.085,is=1e-30, tox=1) sw_vcsp..model s1amod = (ron=1e-5,roff=0.1,von=-6.0,voff=-3.5) sw_vcsp..model s1bmod = (ron=1e-5,roff=0.1,von=-3.5,voff=-6.0) sw_vcsp..model s2amod = (ron=1e-5,roff=0.1,von=-2.5,voff=4.95) sw_vcsp..model s2bmod = (ron=1e-5,roff=0.1,von=4.95,voff=-2.5)
ESG
LDRAIN DPLCAP 10 RSLC1 51 RSLC2 ISCL RLDRAIN RDBREAK 72 DBREAK 11 MWEAK DBODY MMED MSTRO CIN 8 EBREAK + 17 18 71 RDBODY 5 DRAIN 2
6 8 + EVTHRES + 19 8 6
50 RDRAIN 21 16
c.ca n12 n8 = 28.5e-10 c.cb n15 n14 = 26.5e-10 c.cin n6 n8 = 19e-10 d.dbody n7 n71 = model=dbodymod d.dbreak n72 n11 = model=dbreakmod d.dplcap n10 n5 = model=dplcapmod i.it n8 n17 = 1 l.ldrain n2 n5 = 2.0e-9 l.lgate n1 n9 = 1e-9 l.lsource n3 n7 = 4.69e-10
GATE 1
LGATE
EVTEMP RGATE + 18 22 9 20
RLGATE
RSOURCE
LSOURCE 7 RLSOURCE SOURCE 3
S1A 12 S1B CA 13 + EGS 6 8 13 8
S2A 14 13 S2B CB + EDS 5 8 14 IT 15 17
RBREAK 18 RVTEMP 19
m.mmed n16 n6 n8 n8 = model=mmedmod, l=1u, w=1u m.mstrong n16 n6 n8 n8 = model=mstrongmod, l=1u, w=1u m.mweak n16 n21 n8 n8 = model=mweakmod, l=1u, w=1u res.rbreak n17 n18 = 1, tc1=0.8e-3,tc2=-1e-6 res.rdbody n71 n5 = 3.3e-3, tc1=2.0e-3, tc2=0.1e-5 res.rdbreak n72 n5 = 3.5e-1, tc1=1e-3, tc2=1e-6 res.rdrain n50 n16 = 13e-3, tc1=1e-2,tc2=1.75e-5 res.rgate n9 n20 = 0.7 res.rldrain n2 n5 = 20 res.rlgate n1 n9 = 10 res.rlsource n3 n7 = 4.69 res.rslc1 n5 n51 = 1e-6, tc1=2.8e-3,tc2=14e-6 res.rslc2 n5 n50 = 1e3 res.rsource n8 n7 = 4.5e-3, tc1=0,tc2=0 res.rvtemp n18 n19 = 1, tc1=-2.75e-3,tc2=0.05e-9 res.rvthres n22 n8 = 1, tc1=-2e-3,tc2=-1.75e-5 spe.ebreak n11 n7 n17 n18 = 110 spe.eds n14 n8 n5 n8 = 1 spe.egs n13 n8 n6 n8 = 1 spe.esg n6 n10 n6 n8 = 1 spe.evtemp n20 n6 n18 n22 = 1 spe.evthres n6 n21 n19 n8 = 1 sw_vcsp.s1a n6 n12 n13 n8 = model=s1amod sw_vcsp.s1b n13 n12 n13 n8 = model=s1bmod sw_vcsp.s2a n6 n15 n14 n13 = model=s2amod sw_vcsp.s2b n13 n15 n14 n13 = model=s2bmod v.vbat n22 n19 = dc=1
VBAT +
-
-
8 22 RVTHRES
equations { i (n51->n50) +=iscl iscl: v(n51,n50) = ((v(n5,n51)/(1e-9+abs(v(n5,n51))))*((abs(v(n5,n51)*1e6/115))** 4)) } }
4-8
HAF70009 Spice Thermal Model
REV APRIL 1998 HUF75639 CTHERM1 TH 6 5.0e-3 CTHERM2 6 5 1.9e-2 CTHERM3 5 4 7.95e-3 CTHERM4 4 3 9.0e-3 CTHERM5 3 2 2.95e-2 CTHERM6 2 TL 12.55 RTHERM1 TH 6 5.04e-3 RTHERM2 6 5 1.25e-2 RTHERM3 5 4 3.54e-2 RTHERM4 4 3 1.98e-1 RTHERM5 3 2 2.99e-1 RTHERM6 2 TL 3.97e-2
TH JUNCTION
RTHERM1
CTHERM1
6
RTHERM2
CTHERM2
5
Saber Thermal Model
Saber thermal model HUF75639 template thermal_model th tl thermal_c th, tl { ctherm.ctherm1 th 6 = 5.0e-3 ctherm.ctherm2 6 5 = 1.9e-2 ctherm.ctherm3 5 4 = 7.95e-3 ctherm.ctherm4 4 3 = 9.0e-3 ctherm.ctherm5 3 2 = 2.95e-2 ctherm.ctherm6 2 tl = 12.55 rtherm.rtherm1 th 6 = 5.04e-3 rtherm.rtherm2 6 5 = 1.25e-2 rtherm.rtherm3 5 4 = 3.54e-2 rtherm.rtherm4 4 3 = 1.98e-1 rtherm.rtherm5 3 2 = 2.99e-1 rtherm.rtherm6 2 tl = 3.97e-2 }
RTHERM3
CTHERM3
4
RTHERM4
CTHERM4
3
RTHERM5
CTHERM5
2
RTHERM6
CTHERM6
TL
CASE
4-9
HAF70009 TO-220AB
3 LEAD JEDEC TO-220AB PLASTIC PACKAGE
A OP Q H1 D E1 45o D1 TERM. 4 E A1
INCHES SYMBOL A A1 b b1 c D D1 E E1 e e1 MIN 0.170 0.048 0.030 0.045 0.014 0.590 0.395 MAX 0.180 0.052 0.034 0.055 0.019 0.610 0.160 0.410 0.030 0.100 TYP 0.200 BSC 0.235 0.100 0.530 0.130 0.149 0.102 0.255 0.110 0.550 0.150 0.153 0.112
MILLIMETERS MIN 4.32 1.22 0.77 1.15 0.36 14.99 10.04 MAX 4.57 1.32 0.86 1.39 0.48 15.49 4.06 10.41 0.76 2.54 TYP 5.08 BSC 5.97 2.54 13.47 3.31 3.79 2.60 6.47 2.79 13.97 3.81 3.88 2.84 NOTES 3, 4 2, 3 2, 3, 4 5 5 6 2 -
L1
b1 b c
L 60o 1 2 3
e e1
J1
H1 J1 L L1 OP Q
NOTES: 1. These dimensions are within allowable dimensions of Rev. J of JEDEC TO-220AB outline dated 3-24-87. 2. Lead dimension and finish uncontrolled in L1. 3. Lead dimension (without solder). 4. Add typically 0.002 inches (0.05mm) for solder coating. 5. Position of lead to be measured 0.250 inches (6.35mm) from bottom of dimension D. 6. Position of lead to be measured 0.100 inches (2.54mm) from bottom of dimension D. 7. Controlling dimension: Inch. 8. Revision 2 dated 7-97.
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NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (407) 724-7000 FAX: (407) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029
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